350–400 W
Practical limit of conventional direct-to-chip air cooling
Patented air-based cooling platform
Liquid-Class Cooling.
With Air
JouleForce™ pushes direct-to-chip air cooling beyond the practical limits of conventional heat sinks. Its patented microchannel arrays and precisely controlled airflow remove heat more effectively, delivering lower thermal resistance, lower chip temperatures, and less throttling under sustained compute loads.
Zero water loops · No rack plumbing · Built for the future
A third cooling path
Two Imperfect Paths. Now a Third Option.
Traditional Air
Simple and proven, but increasingly constrained as chip power and rack density rise.
Liquid Cooling
Handles higher loads, but adds CDUs, plumbing, service complexity, and facility changes.
JouleForce Air Cooling
Extends air cooling to higher densities without rack-level liquid loops or rebuilding the facility.
The problem
Cooling is constraining high-density deployment.
AI accelerators are moving into 1,000 W to 2,000 W power envelopes, while rack density is rising faster than conventional air can support. Liquid cooling handles higher heat loads, but adds plumbing, CDUs, service complexity, water exposure risk, and longer retrofit cycles. JouleForce raises air-cooled density without rebuilding the rack around liquid.
Processor power envelope · Watts per accelerator
Processor Demand is Outgrowing Conventional Air Cooling
Processor power demand
JouleForce cooling capacity
1,000–2,000 W+
AI accelerator power envelopes, current and next-gen
30%+
Average data-center power footprint spent on cooling
Independently validated · Villanova LATFS
Cooling performance verified by an independent lab.
"This effectively extends the practical limits and lifecycle of air-cooling technologies."
Dr. Alfonso Ortega, Villanova University
Dr. Ortega reproduced Forced Physics' thermal-resistance and pressure-drop results within 3-5%. Dr. Ortega's evaluation also found 50% lower thermal resistance and one-third the airflow vs. the Dell reference heat sink.
Within 3-5%
Villanova reproduction of Forced Physics' SP5 results.
50% less thermal resistance
At one-third the airflow of the Dell reference heat sink.
How to engage
Start with your target hardware.
JouleForce engagements start with your target hardware and measurable thermal goals.
01
Chip and Silicon
Design and fabricate a socket or package POC, then validate reference-design and license.
02
Server OEM
Develop a Chassis-POC, validate on live compute and pursue a design win.
03
Data Center
Jointly develop a rack-level demonstration or evaluate an air-cooled retrofit.
04
Edge
Compact high-density cooling where liquid service infrastructure is impractical.
How the third path works
Change how air meets a hot surface.
JouleForce uses patented microchannel arrays to change how air interacts with the heated surface. Rather than relying on heat removal that depends on bulk airflow over conventional fins, which has met its practical limit, the microchannel geometry increases air's heat removal capacity. This allows for direct-to-chip air cooling with low thermal resistance and a path to higher power density without liquid loops.
Explore the technology →
The decision point is here
We asked the models what they'd choose
We asked the models what they'd choose
You
You're designing cooling for the next generation of AI hardware. Liquid or air, what do you choose, and why?
AI
Assistant
The teams that validate early preserve optionality as chip power rises.
Patented technology
Built on physics, protected by design.
Geometry
Performance comes from patented microchannel architecture, not from adding airflow or shrinking conventional fins.
IP
Protected by an issued patent portfolio covering core array geometry and implementation.
Start a pilot conversation
Ready to Evaluate JouleForce?
Tell us what you are trying to cool: the target hardware, power envelope, ambient condition, and deployment environment. We will scope an evaluation around measurable thermal and performance targets.